response to the increase in outsourcing from our OEM partners,
GM Technical Services has developed state-of-the-art methods and
measures in the assembly of all printed circuit boards. GM Technical
Services' policies, procedures, organizational systems and operations
all comply with ISO 9002 standards. We have established a relationship
with a recognized registrar that will support us in the assessment
and certification process.
following are steps taken in the assembly of all printed circuit
boards at GM Technical Services. Please keep in mind that this
is not an in-depth account of our processes but is a good explanation
of the advanced measures we follow in order to quickly ship defect-free
products to our customers.
Using the Computer Aided Design (CAD) data and Bill of Materials
(BOM) supplied by our customers, we utilize our Siemens VMPS software
to program PCBs for our automated pick-and-place machines.
All resistors, capacitors and smaller ICs supplied on tape-and-reel
are loaded onto one of our 250 Siemens feeders.
and other components which are supplied in tubes are loaded into
our vibratory feeders.
pitch components and BGAs, which are usually supplied on waffle
trays, are loaded on our waffle pack changers. These waffle pack
changers allow us the ability to place 28 different types of fine
pitch and BGA components.
The stencils needed for the application of paste onto the PCBs
are created in our hi-tech stencil printing shop from the gerber
files supplied by our customers. Then using Kester water-soluble
solder paste, our engineers place PCBs in one of our de Haart
screen printers for paste application.
After solder paste has been applied to all pads of the PCB, the
board is passed through one or more of our Siemens Siplace machines.
Our machines have the capability of placing as many as 50,000
components per hour.
After all components have been placed on the PCBs, the boards
are re-flowed in one of our 12 zone pure convection re-flow ovens.
Thermocouples are attached to the first article board to develop
an accurate thermal profile for all subsequent boards.
All water-soluble flux from the solder paste is washed off the
boards using our Batch Cleaner using high-pressure de-ionized
water and turbine blowers for proper drying. After washing, the
cleanliness of the boards is checked with our Alpha Omega Meter
After all components have been re-flowed, they are immediately
inspected by our CR Technology RTI 6500 Vision System for things
such as wrong polarity, wrong part, shifted part, damaged part
and bridging and opens.
Using either selective soldering methods and our Technical Devices
Nu Era wave solder machine or hand-soldering techniques by one
of our skilled work-team members, through-hole components
are applied to the PCBs.
The board washing procedure is repeated.
Next, boards are inspected by one of our work-team engineers
under a 30x magnification microscope. The proper documentation
and traveler tags are included and the PCBs are ready to ship.
Finally, boards are wrapped with antistatic bubbles and shipped
with one of GM Technical Services' delivery vehicles or via our
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